Bridge Semiconductor Corporation is a fabless advanced IC packaging solutions provider.

We are backed by qualified manufacturing partners utilizing state of the art PCB and back-end SMT assembly equipment to deliver cutting-edge IC packaging solutions that meet our customers' needs.

We believe that manufacturing infrastructure and cost effectiveness are two vital elements to bring any packaging idea to realistic volume manufacturing and large scale commercialization.

Therefore, we engineer packaging solutions that start with you - your chips, your concerns, and your customers - to ensure that it is cost and size effective for your ultimate applications.

Next, we design and develop processes and use materials that you are familiar with. We benchmark our processes against recognized industry standards so that you can limit your risks and speed time to market.

Our solutions are adaptable, so you can quickly adjust to design changes; flexible, so you to quickly deploy packaging solutions for various requirements; and scalable, so you can deliver products on-time and on-target.

In short, we make the manufacturing infrastructure for IC packaging work for you and not the other way around.

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