We are a fabless packaging company specializing in providing thermal, electrical and form-factor management solutions.

Our core products include patented substrates, 2D and 3D packages/modules.

Customer could directly purchase substrates from us to align with existing backend assembly supply chain.

Customer could also make use our supply chain management system for a total solution ranging from substrate design to finished package.

We welcome joint product development for customers with special needs.



   
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