This T-slug Embedded (TE) substrate is made possible by incorporating the routing feature of substrate in the QFN backbone structure to allow for higher design flexibility.

Specifically, this thermally enhanced interposer is manufactured by integrating the conventional BGA substrate and etched QFN lead frame technology. These interposers can accommodate multiple dies and passive assembly, provides much-needed electrical characteristics, yet maintains exposed thermal paddle to effect ground connection & facilitate heat dissipation.

These substrates allow assembly adopts conventional manufacturing infrastructure and accommodates standard industry package outlines, footprints, materials, wire-bond and flip chip attachment processes.

TE key features include:
•  Multiple routing layers in QFN backbone
•  Multiple die pads and dimensions allow flexible module design
•  Exposed thermal pad provides excellent thermal performance
•  Allow perimeter and multiple row pad arrangement