To provide designers and assembly packaging engineers with the substrate design guidelines & capabilities using Bridge's T-slug Embedded (TE) type substrate as package interposer.
SCOPE
Current standard TE substrate contains only 2 layers even though advanced version may include 3 to 6 layers.
Packaging structure schematic uses wire-bond type for illustration even though flip chip type is equally applicable.
Schematic View of ThermaLAND Package with TE substrate
Schematic Lay-up View of TE substrate --- Laser Via Type
General Line / Space Specifications
Schematic Lay-up View of TE substrate --- PTH Type
General Line / Space Specifications
Solder Mask and Metal Finishing
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