A computational Fluid Dynamics simulation Model was developed using a total of 12.5W LEDs mounted on the SuperMCPCB vs. on conventional MCPCB (thermal conductivity of dielectric: 8mW/K). MCPCB dimension: 30mm x 30 mm. A finned-type heat sink (150mm x 150mm) made of anodized extruded aluminum are attached to both modules. The result shows that SuperMCPCB provides excellent thermal conduction and offers lower Ti by at least 25℃ compared with that of conventional MCPCBs.

Thermal Measurement Set-up

A continuous temperature measurement of metal core using packages LEDs mounted on the SuperMCPCB and conventional MCPCB respectively. No external heat sink is attached.

Heat Conduction Comparison

The result shows that the temperature of SuperMCPCB rises quickly and exhibits much lower thermal resistance compared to that of conventional MCPCB. After 172 seconds of light-up, the temperature reading of super MCPCB reaches 82℃ whereas the temperature reading of conventional MCPCB only reaches 43℃.