| Item |
PAT. NO. |
|
Title |
| 1 |
10,804,205 |
|
Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same |
| 2 |
10,546,808 |
|
Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly |
| 3 |
10,446,526 |
|
Face-to-face semiconductor assembly having semiconductor device in dielectric recess |
| 4 |
10,420,204 |
|
Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same |
| 5 |
10,361,151 |
|
Wiring board having isolator and bridging element and method of making wiring board |
| 6 |
10,354,984 |
|
Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same |
| 7 |
10,306,777 |
|
Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same |
| 8 |
10,269,722 |
|
Wiring board having component integrated with leadframe and method of making the same |
| 9 |
10,242,964 |
|
Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same |
| 10 |
10,217,710 |
|
Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same |
| 11 |
10,211,067 |
|
Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly |
| 12 |
10,199,321 |
|
Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same |
| 13 |
10,177,130 |
|
Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener |
| 14 |
10,177,090 |
|
Package-on-package semiconductor assembly having bottom device confined by dielectric recess |
| 15 |
10,134,711 |
|
Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same |
| 16 |
10,121,768 |
|
Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same |
| 17 |
10,096,573 |
|
Face-to-face semiconductor assembly having semiconductor device in dielectric recess |
| 18 |
10,062,663 |
|
Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same |
| 19 |
9,947,625 |
|
Wiring board with embedded component and integrated stiffener and method of making the same |
| 20 |
9,913,385 |
|
Methods of making stackable wiring board having electronic component in dielectric recess |
| 21 |
9,825,009 |
|
Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same |
| 22 |
9,640,518 |
|
Semiconductor package with package-on-package stacking capability and method of manufacturing the same |
| 23 |
9,570,372 |
|
Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same |
| 24 |
9,349,711 |
|
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same |
| 25 |
9,299,651 |
|
Semiconductor assembly and method of manufacturing the same |
| 26 |
9,230,901 |
|
Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same |
| 27 |
9,209,154 |
|
Semiconductor package with package-on-package stacking capability and method of manufacturing the same |
| 28 |
9,147,667 |
|
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same |
| 29 |
9,147,587 |
|
Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same |
| 30 |
9,087,847 |
|
Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same |
| 31 |
9,064,878 |
|
Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device |
| 32 |
9,018,667 |
|
Semiconductor chip assembly with post/base heat spreader and dual adhesives |
| 33 |
8,952,526 |
|
Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry |
| 34 |
8,927,339 |
|
Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry |
| 35 |
8,901,435 |
|
Hybrid wiring board with built-in stopper, interposer and build-up circuitry |
| 36 |
8,895,380 |
|
Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby |
| 37 |
8,865,525 |
|
Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby |
| 38 |
8,841,171 |
|
Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry |
| 39 |
8,614,502 |
|
Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device |
| 40 |
8,535,985 |
|
Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump |
| 41 |
8,531,024 |
|
Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace |
| 42 |
8,525,214 |
|
Semiconductor chip assembly with post/base heat spreader with thermal via |
| 43 |
8,415,703 |
|
Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange |
| 44 |
8,378,372 |
|
Semiconductor chip assembly with post/base heat spreader and horizontal signal routing |
| 45 |
8,354,688 |
|
Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump |
| 46 |
8,354,283 |
|
Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump |
| 47 |
8,343,808 |
|
Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry |
| 48 |
8,329,510 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer |
| 49 |
8,324,723 |
|
Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump |
| 50 |
8,324,653 |
|
Semiconductor chip assembly with ceramic/metal substrate |
| 51 |
8,314,438 |
|
Semiconductor chip assembly with bump/base heat spreader and cavity in bump |
| 52 |
8,310,043 |
|
Semiconductor chip assembly with post/base heat spreader with ESD protection layer |
| 53 |
8,304,292 |
|
Method of making a semiconductor chip assembly with a ceramic/metal substrate |
| 54 |
8,298,868 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole |
| 55 |
8,288,792 |
|
Semiconductor chip assembly with post/base/post heat spreader |
| 56 |
8,283,211 |
|
Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump |
| 57 |
8,269,336 |
|
Semiconductor chip assembly with post/base heat spreader and signal post |
| 58 |
8,241,962 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity |
| 59 |
8,236,619 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace |
| 60 |
8,236,618 |
|
Method of making a semiconductor chip assembly with a post/base/post heat spreader |
| 61 |
8,232,576 |
|
Semiconductor chip assembly with post/base heat spreader and ceramic block in post |
| 62 |
8,232,573 |
|
Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace |
| 63 |
8,227,270 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal |
| 64 |
8,212,279 |
|
Semiconductor chip assembly with post/base heat spreader, signal post and cavity |
| 65 |
8,207,553 |
|
Semiconductor chip assembly with base heat spreader and cavity in base |
| 66 |
8,207,019 |
|
Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts |
| 67 |
8,203,167 |
|
Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal |
| 68 |
8,193,556 |
|
Semiconductor chip assembly with post/base heat spreader and cavity in post |
| 69 |
8,178,395 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via |
| 70 |
8,163,603 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding |
| 71 |
8,153,477 |
|
Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader |
| 72 |
8,148,747 |
|
Semiconductor chip assembly with post/base/cap heat spreader |
| 73 |
8,148,207 |
|
Method of making a semiconductor chip assembly with a post/base/cap heat spreader |
| 74 |
8,129,742 |
|
Semiconductor chip assembly with post/base heat spreader and plated through-hole |
| 75 |
8,110,446 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace |
| 76 |
8,076,182 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post |
| 77 |
8,067,784 |
|
Semiconductor chip assembly with post/base heat spreader and substrate |
| 78 |
8,067,270 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate |
| 79 |
8,062,912 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing |
| 80 |
8,034,645 |
|
Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader |
| 81 |
8,003,416 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives |
| 82 |
8,003,415 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing |
| 83 |
7,993,983 |
|
Method of making a semiconductor chip assembly with chip and encapsulant grinding |
| 84 |
7,951,622 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post |
| 85 |
7,948,076 |
|
Semiconductor chip assembly with post/base heat spreader and vertical signal routing |
| 86 |
7,939,375 |
|
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post |
| 87 |
7,932,165 |
|
Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base |
| 88 |
7,901,993 |
|
Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace |
| 89 |
7,833,827 |
|
Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base |
| 90 |
7,811,863 |
|
Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment |
| 91 |
7,750,483 |
|
Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal |
| 92 |
7,656,031 |
|
Stackable semiconductor package having metal pin within through hole of package |
| 93 |
7,538,415 |
|
Semiconductor chip assembly with bumped terminal, filler and insulative base |
| 94 |
7,494,843 |
|
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
| 95 |
7,459,385 |
|
Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler |
| 96 |
7,453,140 |
|
Semiconductor chip assembly with laterally aligned filler and insulative base |
| 97 |
7,446,419 |
|
Semiconductor chip assembly with welded metal pillar of stacked metal balls |
| 98 |
7,425,759 |
|
Semiconductor chip assembly with bumped terminal and filler |
| 99 |
7,419,851 |
|
Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal |
| 100 |
7,417,314 |
|
Semiconductor chip assembly with laterally aligned bumped terminal and filler |
| 101 |
7,414,319 |
|
Semiconductor chip assembly with metal containment wall and solder terminal |
| 102 |
7,396,703 |
|
Method of making a semiconductor chip assembly with a bumped terminal and a filler |
| 103 |
7,319,265 |
|
Semiconductor chip assembly with precision-formed metal pillar |
| 104 |
7,268,421 |
|
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond |
| 105 |
7,264,991 |
|
Method of connecting a conductive trace to a semiconductor chip using conductive adhesive |
| 106 |
7,262,082 |
|
Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture |
| 107 |
7,245,023 |
|
Semiconductor chip assembly with solder-attached ground plane |
| 108 |
7,232,707 |
|
Method of making a semiconductor chip assembly with an interlocked contact terminal |
| 109 |
7,232,706 |
|
Method of making a semiconductor chip assembly with a precision-formed metal pillar |
| 110 |
7,229,853 |
|
Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line |
| 111 |
7,227,249 |
|
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
| 112 |
7,215,019 |
|
Semiconductor chip assembly with pillar press-fit into ground plane |
| 113 |
7,192,803 |
|
Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint |
| 114 |
7,190,080 |
|
Semiconductor chip assembly with embedded metal pillar |
| 115 |
7,190,060 |
|
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
| 116 |
7,157,791 |
|
Semiconductor chip assembly with press-fit ground plane |
| 117 |
7,148,082 |
|
Method of making a semiconductor chip assembly with a press-fit ground plane |
| 118 |
7,132,741 |
|
Semiconductor chip assembly with carved bumped terminal |
| 119 |
7,129,575 |
|
Semiconductor chip assembly with bumped metal pillar |
| 120 |
7,129,113 |
|
Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture |
| 121 |
7,112,521 |
|
Method of making a semiconductor chip assembly with a bumped metal pillar |
| 122 |
7,094,676 |
|
Semiconductor chip assembly with embedded metal pillar |
| 123 |
7,087,466 |
|
Method of making a semiconductor chip assembly with a solder-attached ground plane |
| 124 |
7,075,186 |
|
Semiconductor chip assembly with interlocked contact terminal |
| 125 |
7,071,573 |
|
Semiconductor chip assembly with welded metal pillar |
| 126 |
7,071,089 |
|
Method of making a semiconductor chip assembly with a carved bumped terminal |
| 127 |
7,067,911 |
|
Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture |
| 128 |
7,064,012 |
|
Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps |
| 129 |
7,015,128 |
|
Method of making a semiconductor chip assembly with an embedded metal particle |
| 130 |
7,009,309 |
|
Semiconductor package device that includes an insulative housing with a protruding peripheral portion |
| 131 |
7,009,297 |
|
Semiconductor chip assembly with embedded metal particle |
| 132 |
6,989,584 |
|
Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead |
| 133 |
6,989,295 |
|
Method of making a semiconductor package device that includes an insulative housing with first and second housing portions |
| 134 |
6,987,034 |
|
Method of making a semiconductor package device that includes singulating and trimming a lead |
| 135 |
6,984,576 |
|
Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip |
| 136 |
6,949,408 |
|
Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps |
| 137 |
6,936,495 |
|
Method of making an optoelectronic semiconductor package device |
| 138 |
6,908,794 |
|
Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions |
| 139 |
6,908,788 |
|
Method of connecting a conductive trace to a semiconductor chip using a metal base |
| 140 |
6,891,276 |
|
Semiconductor package device |
| 141 |
6,876,072 |
|
Semiconductor chip assembly with chip in substrate cavity |
| 142 |
6,872,591 |
|
Method of making a semiconductor chip assembly with a conductive trace and a substrate |
| 143 |
6,846,735 |
|
Compliant test probe with jagged contact surface |
| 144 |
6,809,414 |
|
Semiconductor chip assembly with bumped conductive trace |
| 145 |
6,803,651 |
|
Optoelectronic semiconductor package device |
| 146 |
6,800,506 |
|
Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly |
| 147 |
6,794,741 |
|
Three-dimensional stacked semiconductor package with pillars in pillar cavities |
| 148 |
6,774,659 |
|
Method of testing a semiconductor package device |
| 149 |
6,744,126 |
|
Multichip semiconductor package device |
| 150 |
6,740,576 |
|
Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly |
| 151 |
6,716,670 |
|
Method of forming a three-dimensional stacked semiconductor package device |
| 152 |
6,699,780 |
|
Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching |
| 153 |
6,673,710 |
|
Method of connecting a conductive trace and an insulative base to a semiconductor chip |
| 154 |
6,667,229 |
|
Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip |
| 155 |
6,608,374 |
|
Semiconductor chip assembly with bumped conductive trace |
| 156 |
6,593,224 |
|
Method of manufacturing a multilayer interconnect substrate |
| 157 |
6,583,040 |
|
Method of making a pillar in a laminated structure for a semiconductor chip assembly |
| 158 |
6,576,493 |
|
Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps |
| 159 |
6,537,851 |
|
Method of connecting a bumped compliant conductive trace to a semiconductor chip |
| 160 |
6,492,252 |
|
Method of connecting a bumped conductive trace to a semiconductor chip |
| 161 |
6,486,549 |
|
Semiconductor module with encapsulant base |
| 162 |
11,291,146 |
|
Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same |
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