KEY FEATURES

Integrating cavity and routing circuitry onto solid metal provides superior design flexibility and long-term reliability for power device and laser packaging

• Top metal cap designed for external cooling pathway (air or liquid)

• Sidewall metal to ensure EMI coverage

• Resin-defined cavity aims for self-aligned die placement

• Built-in circuitry to enhance routing flexibility for multi-die integration

• Panel format allows for PCB processing

• Ease of use, minimal assembly processes

SCHEMATIC ASSEMBLY EXAMPLE 

Multi-Die Assembly Key Merits

• Excellent thermal characteristics

• Low parasitics and inductance

• Superior EMI shielding

• Mechanically robust and reliable

RELIABILITY DATA